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C2-BG High Quality Soldering Paste Melting at 183°C

C2-BG High Quality Soldering Paste Melting at 183°C
New
C2-BG High Quality Soldering Paste Melting at 183°C
$25.00
Ex Tax: $25.00
Price in reward points: 32
This product has a minimum quantity of 10
The BG High Quality Soldering Paste is a premium solution specifically designed for cellphone repair. It features an optimized Sn63/Pb37 alloy composition, which is often considered a "golden ratio" in soldering. With a weight of 40g, it provides an ample supply for multiple repair jobs. The particle size ranges from 25 - 45um, ensuring smooth and even application. When melted at its 183°C melting point, it creates solid, full, and bright joints, which are essential for high - quality soldering results. It is especially well - suited for BGA reballing, a critical process in cellphone repair that requires precision and reliable soldering performance.

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