T3-BG IC soldering paste planting stencil for HiSilicon

New

T3-BG IC soldering paste planting stencil for HiSilicon

0 reviews • Write a review

$364.73

Ex Tax: $364.73

Price in reward points: 32

Qty

Add to Cart

Submit inquiry Question?

Add to Wish List Compare this Product

Tags: BG IC soldering , HiSilicon Kirin 9000S , Hi36905G , solder paste stencil , IC soldering tools , mobile repair , Kirin chip repair , HiSilicon chipset , stencil for soldering , paste planting sten

BG IC Soldering Paste Planting Stencil is specifically designed for HiSilicon chips, including the Kirin 9000S, Hi36905G, Hi36904G, Hi3660, Hi6280, Hi6260, Hi3670, Hi3680, and more. Ideal for precise soldering and paste application in the mobile and electronics repair industry, this high-quality stencil ensures accurate placement of solder paste for various HiSilicon chipsets. Perfect for repair professionals, technicians, and DIY enthusiasts working with HiSilicon processors and other IC components.

Builder in Product TAB

NEW! Since Journal 3.2, the much improved T.A.B (Tabs Accordion Blocks) system supports the page builder inside the tab content. Unlimited Blocks, Tabs or Accordions with any HTML content or the builder interface (supporting custom rows/columns/modules) can be assigned to any individual product or to certain groups of products, like entire categories, brands, products with specific options, attributes, price range, etc. You can indicate any criteria via the advanced product assignment mechanism and only those products matching your criteria will display the modules. Also, any module can be selectively activated per device (desktop/tablet/phone), customer login status and other criteria. Imagine the possibilities.