T5-BG IC soldering paste planting stencil for Qualcomm

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T5-BG IC soldering paste planting stencil for Qualcomm

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$120.37

$364.73

Ex Tax: $120.37

Price in reward points: 32

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Tags: Snapdragon 210 , Snapdragon 410 , Snapdragon 625 , Snapdragon 820 , Snapdragon 845 , Snapdragon 855 , Snapdragon 865 , Snapdragon 888 , Snapdragon 8 Gen1 , Snapdragon 8 Gen2 , MSM8909 , MSM8916 , MSM8953 , soldering stencils , precision soldering , mobile device repair

range of Snapdragon chipsets, including models like the Snapdragon 210, 410, 625, 820, 845, and the latest Snapdragon 8 series. Designed for high performance and efficiency, our IC stencils ensure precise solder paste application for various chip categories, enhancing the reliability and effectiveness of repairs. Suitable for repair technicians and manufacturers, these stencils cater specifically to models such as MSM8909, MSM8916, MSM8953, MSM8996, and many more, guaranteeing optimal soldering conditions for mobile devices.

Optimize your device repair solutions with our

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