T4-BG IC soldering paste planting stencil for IPHONE CUP repair

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T4-BG IC soldering paste planting stencil for IPHONE CUP repair

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$120.37

$364.73

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Tags: G IC soldering paste stencil iPhone CUP repair iPhone A-series A8 stencil A9 stencil A10 stencil A11 stencil A12 stencil A13 stencil A14 stencil A15 stencil A16 stencil soldering stencils precision solder paste

The BG IC soldering paste planting stencil is expertly designed for chip-on-board (CUP) repairs of iPhone A-series chips, specifically from A8 to A18. This high-quality stencil ensures precise and uniform application of solder paste, enhancing the efficiency and effectiveness of the soldering process. Ideal for repair technicians, this stencil is essential for maintaining quality and consistency in iPhone IC repairs, ultimately reducing defects and improving overall repair outcomes.

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