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C5-BG High Quality Soldering Paste Sn63/Pb37 alloy, 40g in weight, 25 - 45um particle size
$364.73
Ex Tax: $364.73
Price in reward points: 32
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The BG High Quality Soldering Paste183℃ is a top - tier product tailored specifically for cellphone repair. Its unique formulation with an Sn63/Pb37 alloy, often regarded as the "golden ratio" in soldering, ensures exceptional soldering performance. Each pack comes with 40g of the paste, providing a sufficient quantity for multiple repair jobs.
The solder paste has a particle size in the range of 25 - 45um, which enables smooth and even application, facilitating better contact with components during soldering. With a melting point of precisely 183°C, it offers reliable and consistent melting behavior. This melting point is optimal for creating solid, full, and bright joints, which are essential for ensuring the long - term reliability and performance of repaired cellphones.
Particularly, it excels in BGA reballing, a complex and critical process in cellphone repair. The paste's properties allow for accurate and efficient reballing, enhancing the success rate of component reattachment and overall repair quality. Whether you're a professional cellphone repair technician or an electronics enthusiast working on mobile devices, the BG High Quality Soldering Paste183℃ is an indispensable tool
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