The BG High Quality Soldering Paste183℃ is a top - tier product tailored specifically for cellphone repair. Its unique formulation with an Sn63/Pb37 alloy, often regarded as the "golden ratio" in soldering, ensures exceptional soldering performance. Each pack comes with 40g of the paste, providing a sufficient quantity for multiple repair jobs.
The solder paste has a particle size in the range of 25 - 45um, which enables smooth and even application, facilitating better contact with components during soldering. With a melting point of precisely 183°C, it offers reliable and consistent melting behavior. This melting point is optimal for creating solid, full, and bright joints, which are essential for ensuring the long - term reliability and performance of repaired cellphones.
Particularly, it excels in BGA reballing, a complex and critical process in cellphone repair. The paste's properties allow for accurate and efficient reballing, enhancing the success rate of component reattachment and overall repair quality. Whether you're a professional cellphone repair technician or an electronics enthusiast working on mobile devices, the BG High Quality Soldering Paste183℃ is an indispensable tool
Builder in Product TAB
NEW! Since Journal 3.2, the much improved T.A.B (Tabs Accordion Blocks) system supports the page builder inside the tab content. Unlimited Blocks, Tabs or Accordions with any HTML content or the builder interface (supporting custom rows/columns/modules) can be assigned to any individual product or to certain groups of products, like entire categories, brands, products with specific options, attributes, price range, etc.
You can indicate any criteria via the advanced product assignment mechanism and only those products matching your criteria will display the modules.
Also, any module can be selectively activated per device (desktop/tablet/phone), customer login status and other criteria. Imagine the possibilities.
The BG High Quality Soldering Paste is a premium solution specifically designed for cellphone repair. It features an optimized Sn63/Pb37 alloy composi..
The BG High Quality Soldering Paste is a top - notch product designed for soldering applications. It has a melting temperature of 196°C and is formula..
The BG High Quality Soldering Paste is a specialized product tailored for precision soldering projects, particularly those involving iPhone middle lay..
BG The Special Cutting Wire for Mobile Glass is expertly engineered for precision cutting with a hardness rating of 37.5HB. This specialized wire is a..
BG The Special Cutting Wire for Mobile Glass is expertly engineered for precision cutting with a hardness rating of 37.5HB. This specialized wire is a..
BG The Special Cutting Wire for Mobile Glass is expertly engineered for precision cutting with a hardness rating of 37.5HB. This specialized wire is a..
BG The Special Cutting Wire for Mobile Glass is expertly engineered for precision cutting with a hardness rating of 37.5HB. This specialized wire is a..
BG The Special Cutting Wire for Mobile Glass is expertly engineered for precision cutting with a hardness rating of 37.5HB. This specialized wire is a..
BG The Special Cutting Wire for Mobile Glass is expertly engineered for precision cutting with a hardness rating of 37.5HB. This specialized wire is a..
The BG Precise Jump Wire is designed for motherboard repair and electronic applications. It comes in three precise wire sizes: 0.009MM, 0.01MM, and 0...
The BG Precise Jump Wire is designed for motherboard repair and electronic applications. It comes in three precise wire sizes: 0.009MM, 0.01MM, and 0...
The BG High Quality Soldering Paste is a premium solution specifically designed for cellphone repair. It features an optimized Sn63/Pb37 alloy composi..
The BG High Quality Soldering Paste is a top - notch product designed for soldering applications. It has a melting temperature of 196°C and is formula..
The BG High Quality Soldering Paste is a specialized product tailored for precision soldering projects, particularly those involving iPhone middle lay..
