New
C2-BG High Quality Soldering Paste Melting at 183°C
$25.00
Ex Tax: $25.00
Price in reward points: 32
This product has a minimum quantity of 10
Why buy from us?
Lorem Ipsum is simply dummy text of the printing and typesetting industry.
Ask a Question About This Product
Tags:
BG soldering paste
, cellphone repair
, Sn63/Pb37
, 183°C melting
, 25 - 45um
, 40g
, BGA reballing
, soldering for cellphones
The BG High Quality Soldering Paste is a premium solution specifically designed for cellphone repair. It features an optimized Sn63/Pb37 alloy composition, which is often considered a "golden ratio" in soldering. With a weight of 40g, it provides an ample supply for multiple repair jobs. The particle size ranges from 25 - 45um, ensuring smooth and even application. When melted at its 183°C melting point, it creates solid, full, and bright joints, which are essential for high - quality soldering results. It is especially well - suited for BGA reballing, a critical process in cellphone repair that requires precision and reliable soldering performance.
Builder in Product TAB
NEW! Since Journal 3.2, the much improved T.A.B (Tabs Accordion Blocks) system supports the page builder inside the tab content. Unlimited Blocks, Tabs or Accordions with any HTML content or the builder interface (supporting custom rows/columns/modules) can be assigned to any individual product or to certain groups of products, like entire categories, brands, products with specific options, attributes, price range, etc.
You can indicate any criteria via the advanced product assignment mechanism and only those products matching your criteria will display the modules.
Also, any module can be selectively activated per device (desktop/tablet/phone), customer login status and other criteria. Imagine the possibilities.









