The BG Magnetic Levitation Platform For Chip Tin Planting is a cutting-edge solution in the field of electronics manufacturing and repair. This innovative platform is specifically designed to cater to the needs of tin planting for multiple chips, making it an essential tool for professionals and enthusiasts alike.
One of the most striking features of this platform is its strong magnetic levitation design. The maglev technology enables automatic clamping of the chips, providing a secure and stable hold during the tin planting process. This not only eliminates the need for manual clamping, which can be time-consuming and prone to errors, but also ensures that the chips are positioned accurately. The automatic clamping feature also reduces the risk of damaging the delicate chips, as it applies a consistent and gentle force.
The platform is constructed from a nanocomposite material, which offers a multitude of benefits. It is highly anti-static, preventing the build-up of static electricity that could potentially damage the chips. Additionally, it is resistant to corrosion, ensuring that the platform remains in good condition even when exposed to harsh environments or chemicals. The wear-resistant properties of the nanocomposite material make it durable and long-lasting, capable of withstanding the rigors of frequent use. Moreover, it is highly resistant to high temperatures, which is crucial during the tin planting process where heat is often involved.
The expandability of the BG Magnetic Levitation Platform is another significant advantage. It allows for the easy update of chip data, enabling users to adapt to the changing requirements of different chip models. This flexibility ensures that the platform remains relevant and useful in the ever-evolving field of electronics. The inclusion of a high-temperature resistant steel mesh further enhances the platform's performance. The steel mesh provides a stable and reliable surface for the chips, while also being able to withstand the high temperatures generated during the tin planting process.
The sliding mag module is a unique and practical feature of this platform. It allows for easy adjustment and positioning of the magnetic field, providing greater control over the tin planting process. This feature enables users to fine-tune the magnetic force applied to the chips, ensuring optimal results. Whether you are a professional electronics manufacturer looking to increase your production efficiency or a repair technician aiming to improve the quality of your work, the BG Magnetic Levitation Platform For Chip Tin Planting is a reliable and advanced tool that can meet your needs.
Builder in Product TAB
NEW! Since Journal 3.2, the much improved T.A.B (Tabs Accordion Blocks) system supports the page builder inside the tab content. Unlimited Blocks, Tabs or Accordions with any HTML content or the builder interface (supporting custom rows/columns/modules) can be assigned to any individual product or to certain groups of products, like entire categories, brands, products with specific options, attributes, price range, etc.
You can indicate any criteria via the advanced product assignment mechanism and only those products matching your criteria will display the modules.
Also, any module can be selectively activated per device (desktop/tablet/phone), customer login status and other criteria. Imagine the possibilities.
The BG tin arc silicone mat is a specialized accessory. It has a remarkable high - temperature resistance of up to 800°C, which allows it to maintain ..
The BG Magnetic Levitation Platform For Chip Tin Planting is a cutting-edge solution in the field of electronics manufacturing and repair. This innova..
BG IC Soldering Paste Planting Stencil is specifically designed for HiSilicon chips, including the Kirin 9000S, Hi36905G, Hi36904G, Hi3660, Hi6280, Hi..
The BG IC soldering paste planting stencil is expertly designed for chip-on-board (CUP) repairs of iPhone A-series chips, specifically from A8 to A18...
