BG Magnetic Levitation Platform For Chip in Planting
1.For multiple chips' tin planting. Strong aglev design for auto clamping.
2.Nanocomposite, anti-static/anticorrosion/ ear-resistant/high-temp resistant.
3.Expandable, updates chip data. High-temp esistant steel mesh. Sliding mag module.
BG Motherboard Glue Removing Blade
1.Remove CPU and hard disk
2.IC glue remover
3.Clean the frame glue
4.Cutting the glue
BG Magnetic Levitation Platform For Chip in Planting
1.For multiple chips' tin planting. Strong aglev design for auto clamping.
2.Nanocomposite, anti-static/anticorrosion/ ear-resistant/high-temp resistant.
3.Expandable, updates chip data. High-temp esistant steel mesh. Sliding mag module.
BG Motherboard Glue Removing Blade
1.Remove CPU and hard disk
2.IC glue remover
3.Clean the frame glue
4.Cutting the glue
BG Magnetic Levitation Platform For Chip in Planting
1.For multiple chips' tin planting. Strong aglev design for auto clamping.
2.Nanocomposite, anti-static/anticorrosion/ ear-resistant/high-temp resistant.
3.Expandable, updates chip data. High-temp esistant steel mesh. Sliding mag module.
BG Motherboard Glue Removing Blade
1.Remove CPU and hard disk
2.IC glue remover
3.Clean the frame glue
4.Cutting the glue
BG Magnetic Levitation Platform For Chip in Planting
1.For multiple chips' tin planting. Strong aglev design for auto clamping.
2.Nanocomposite, anti-static/anticorrosion/ ear-resistant/high-temp resistant.
3.Expandable, updates chip data. High-temp esistant steel mesh. Sliding mag module.
BG Motherboard Glue Removing Blade
1.Remove CPU and hard disk
2.IC glue remover
3.Clean the frame glue
4.Cutting the glue
BG Magnetic Levitation Platform For Chip in Planting
1.For multiple chips' tin planting. Strong aglev design for auto clamping.
2.Nanocomposite, anti-static/anticorrosion/ ear-resistant/high-temp resistant.
3.Expandable, updates chip data. High-temp esistant steel mesh. Sliding mag module.
Chip tin implantation