BG The Special Cutting Wire for Mobile Glass
Strong series of diamond wire, with unique toughness to provide users with a different product experience
New nanomaterials, toughness upgrade, the breaking force of 16.5N
Smooth surface, no damage to polarized light
Ultra-fine 0.028MM diamond wire, almost only half of the hair, feel the new experience of dismantling the screen
New nanomaterials for innovative breakthroughs
High tensile strength, to meet the toughness requirements, after thousands of repeated experiments
High finish, no damage to polarized light, smooth and silky even under high magnification microscopes
BG Motherboard Glue Removing Blade
1.Remove CPU and hard disk
2.IC glue remover
3.Clean the frame glue
4.Cutting the glue
BG offers specialized cutting wire designed specifically for mobile glass. With a hardness of up to 37.5HB, this wire ensures precise and efficient cutting operations. Available in a variety of sizes including 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.08mm, and 0.10mm, it caters to different mobile glass cutting requirements, providing manufacturers with the flexibility to choose the most suitable wire for their production processes.









